Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Eric Li0
Jimin Yao0
Shawna Liff0
Date of Patent
April 2, 2019
0Patent Application Number
150891360
Date Filed
April 1, 2016
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Electronic device package technology is disclosed. In one example, an electronic device package can include a substrate, an electronic component disposed on the substrate and electrically coupled to the substrate, and an underfill material disposed at least partially between the electronic component and the substrate. A lateral portion of the underfill material can comprises a lateral surface extending away from the substrate and a meniscus surface extending between the lateral surface and the electronic component.
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