US Patent 10249518 Polishing device and polishing method
Patent 10249518 was granted and assigned to Toshiba Memory Corporation on April, 2019 by the United States Patent and Trademark Office.
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Patent abstract
According to one embodiment, a polishing device includes a stage holding a wafer, a polishing part polishing a film formed on a circumferential edge portion of the wafer, a detector detecting a residual portion of the film on the circumferential edge portion, a first movable part moving the detector along a surface of the circumferential edge portion; and a controller controlling the polishing part based on a state of the circumferential edge portion detected by the detector.
Edits on 25 Apr, 2023
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Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
102495180
Date of Patent
April 2, 2019
0Patent Application Number
148442140
Date Filed
September 3, 2015
0Patent Citations Received
Patent Primary Examiner
Edits on 28 Sep, 2022
Golden AI
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
102495180
Date of Patent
April 2, 2019
0Patent Application Number
148442140
Date Filed
September 3, 2015
0Patent Citations Received
Patent Primary Examiner
Edits on 7 Feb, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent citations received
Edits on 25 Jan, 2022
Golden AI
Edits made to:
Infobox (+9 properties)
US Patent 10249518 Polishing device and polishing method
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10249518
Date of patent
April 2, 2019
Patent application number
14844214
Date Filed
September 3, 2015
Patent primary examiner
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