Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Young Gwan Ko0
Han Kim0
Jung Ho Shim0
Kang Heon Hur0
Dae Hyun Park0
Date of Patent
April 9, 2019
0Patent Application Number
158770210
Date Filed
January 22, 2018
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An electronic component package and a method of manufacturing the same are provided. The electronic component package includes a frame having a through-hole, an electronic component disposed in the through-hole of the frame, and a redistribution part disposed at one side of the frame and the electronic component. One or more first wiring layers of the frame are electrically connected to the electronic component through the redistribution part.
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