Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
William Ng0
Frederick A. Ware0
Thomas Vogelsang0
Date of Patent
April 16, 2019
Patent Application Number
15393634
Date Filed
December 29, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
Embodiments generally relate to integrated circuit devices having through silicon vias (TSVs). In one embodiment, an integrated circuit (IC) device includes a field of TSVs and an address decoder that selectably couples at least one of the TSVs to at least one of a test input and a test evaluation circuit. In another embodiment, a method includes selecting one or more TSVs from a field of TSVs in at least one IC device, and coupling each selected TSV to at least one of a test input and a test evaluation circuit.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.