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US Patent 10264670 Structure for flexible printed circuit boards

Patent 10264670 was granted and assigned to LG on April, 2019 by the United States Patent and Trademark Office.

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Golden AI
edited on 19 Sep, 2024
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Patent Citations Received
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US Patent 12096549 Panel molded electronic assemblies with multi-surface conductive contacts
0
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edited on 9 Dec, 2023
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Patent abstract

A flexible printed circuit board installed on a substrate in a display device is provided.

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edited on 23 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=1026467000
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edited on 22 Mar, 2023
Infobox
Is a
Patent
Patent
0
Patent Applicant
LG
LG
0
Current Assignee
LG
LG
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
102646700
Date of Patent
April 16, 2019
0
Patent Application Number
159429130
Date Filed
April 2, 2018
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=102646700
Patent Citations Received
‌
US Patent 10398040 Power adapter packaging
0
‌
US Patent 11324107 Panel molded electronic assemblies with multi-surface conductive contacts
0
Patent Primary Examiner
‌
Binh B Tran
0
Edits on 26 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 26 Sep, 2022
Edits on 25 Sep, 2022
"Entity importer update"
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Golden AI
edited on 25 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Applicant
LG
LG
0
Current Assignee
LG
LG
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
102646700
Date of Patent
April 16, 2019
0
Patent Application Number
159429130
Date Filed
April 2, 2018
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=102646700
Patent Citations Received
‌
US Patent 10398040 Power adapter packaging
0
‌
US Patent 11324107 Panel molded electronic assemblies with multi-surface conductive contacts
0
Patent Primary Examiner
‌
Binh B Tran
0
Edits on 22 Sep, 2022
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 22 Sep, 2022
Infobox
Patent Citations Received
‌
US Patent 10398040 Power adapter packaging
0
Edits on 18 Jun, 2022
"Entity importer update"
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Golden AI
edited on 18 Jun, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10264670
Edits on 19 May, 2022
"update inverses"
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Golden AI
edited on 19 May, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Patent citations received
‌
US Patent 11324107 Panel molded electronic assemblies with multi-surface conductive contacts
Edits on 28 Jan, 2022
"update inverses"
Golden AI profile picture
Golden AI
edited on 28 Jan, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Patent citations received
‌
US Patent 10398040 Power adapter packaging
Edits on 25 Jan, 2022
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Golden AI
created this topic on 25 Jan, 2022
Edits made to:
Infobox (+9 properties)
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 US Patent 10264670 Structure for flexible printed circuit boards

Infobox
Is a
Patent
Patent
Patent applicant
LG
LG
Current assignee
LG
LG
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10264670
Date of patent
April 16, 2019
Patent application number
15942913
Date Filed
April 2, 2018
Patent primary examiner
‌
Binh B Tran

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