US Patent 10265770 Binderless metal injection molding apparatus and method

A metal injection molding apparatus includes a metal injection mold die having first and second die halves, a first set of features provided in the first die half, a second set of features provided in the second die half and complementary to the first set of features provided in the first are half and an ultrasonic transducer disposed in contact with the metal injection mold die. A binderless metal injection molding method is also disclosed.