US Patent 10269647 Self-aligned EPI contact flow

Methods for forming semiconductor devices, such as FinFETs, are provided. In one embodiment, a method for forming a FinFET device includes removing a portion of each fin of a plurality of fins, and a remaining portion of each fin is recessed from a dielectric surface. The method further includes forming a feature on the remaining portion of each fin, filling gaps formed between adjacent features with a dielectric material, removing the features, and forming a fill material on the remaining portion of each fin. Because the shape of the features is controlled, the shape of the fill material can be controlled.