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US Patent 10269649 Wrap-around contact on FinFET
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Patent
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Date Filed
March 28, 2018
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Date of Patent
April 23, 2019
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Patent Applicant
Taiwan Semiconductor Manufacturing Company
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Patent Application Number
15938225
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Patent Citations Received
US Patent 11757020 Semiconductor device and method
US Patent 11532517 Localized etch stop layer
Patent Inventor Names
Yi-An Lin
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Neng-Kuo Chen
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Sey-Ping Sun
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Sung-Li Wang
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Chen-Feng Hsu
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Chih-Hsin Ko
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Clement Hsingjen Wann
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Ding-Kang Shih
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Gin-Chen Huang
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Hau-Yu Lin
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•••
Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10269649
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Patent Primary Examiner
Mounir S Amer
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