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US Patent 10269802 Semiconductor device and manufacturing method thereof

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
May 15, 2015
Date of Patent
April 23, 2019
Patent Application Number
14714231
Patent Citations Received
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US Patent 12132050 Semiconductor structure cutting process and structures formed thereby
0
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US Patent 11075082 Semiconductor device and manufacturing method thereof
0
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US Patent 11621343 Method of manufacturing semiconductor devices and semiconductor devices
0
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US Patent 11894370 Semiconductor structure cutting process and structures formed thereby
0
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US Patent 11502076 Semiconductor structure cutting process and structures formed thereby
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US Patent 10879374 Semiconductor device and manufacturing method thereof
0
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US Patent 11245018 Semiconductor device including a gate structure with a wider end portion than a linear portion
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US Patent 11600639 Semiconductor device and method of manufacturing the same
0
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US Patent 11069791 Method of manufacturing semiconductor devices and semiconductor devices
Patent Inventor Names
Chih-Han Lin
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10269802
Patent Primary Examiner
‌
Steven H Loke

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