Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yu-Feng Chen0
Hao-Yi Tsai0
Hui-Jung Tsai0
Hung-Jui Kuo0
Chen-Hua Yu0
Chih-Hua Chen0
Chung-Shi Liu0
Date of Patent
April 30, 2019
Patent Application Number
15147910
Date Filed
May 6, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package has a first redistribution layer, a first die, a second redistribution layer, and a surface coating layer. The first die is encapsulated within a molding material and disposed on and electrically connected to the first redistribution layer. The second redistribution layer is disposed on the molding material, on the first die, and electrically connected to the first die. The second redistribution layer has a topmost metallization layer having at least one contact pad, and the at least one contact pad includes a concave portion. The surface coating layer covers a portion of the topmost metallization layer and exposes the concave portion of the at least one contact pad. A manufacturing process is also provided.
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