Patent attributes
A substrate structure includes a dielectric layer, a first circuit layer, a second circuit layer and at least one conductive pillar. The dielectric layer has a first surface and a second surface opposite to the first surface. The first circuit layer is disposed adjacent to the first surface of the dielectric layer. The second circuit layer is disposed adjacent to the second surface of the dielectric layer and electrically connected to the first circuit layer. The second circuit layer includes a plurality of pads and at least one trace disposed between two adjacent pads of the plurality of pads. The at least one conductive pillar is tapered toward the second circuit layer and disposed on one of the pads. A portion of the second surface of the dielectric layer is exposed from the second surface layer.