US Patent 10276498 Interconnect structure with air-gaps

In some embodiments, the present disclosure relates to an interconnect structure. The interconnect structure has a first dielectric layer disposed over a substrate and a conductive structure arranged within the first dielectric layer. An air-gap separates sidewalls of the conductive structure from the first dielectric layer. The air-gap continuously extends from a first side of the conductive structure to an opposing second side of the conductive structure.