Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shou-Zen Chang0
Chen-Hua Yu0
Chung-Shi Liu0
Min-Chien Hsiao0
Chao-Wen Shih0
Date of Patent
April 30, 2019
0Patent Application Number
157179760
Date Filed
September 28, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
In accordance with some embodiments, a package structure includes an RFIC chip. an insulating encapsulation, a redistribution circuit structure, an antenna and a microwave director. The insulating encapsulation encapsulates the RFIC chip. The redistribution circuit structure is disposed on the insulating encapsulation and electrically connected to the RFIC chip. The antenna is disposed on the insulating encapsulation and electrically connected to the RFIC chip through the redistribution circuit structure. The antenna is located between the microwave director and the RFIC chip. The microwave director has a microwave directivity enhancement surface located at a propagating path of a microwave received or generated by the antenna.
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