US Patent 10278281 MEMS stress isolation and stabilization system

A MEMS thermal stress isolation system is disclosed. The MEMs thermal stress isolation system is a MEMS embedded hardware implementation designed to isolate the sensitive sensor die from external stresses caused by rigid attachment to packaging and to allow the sensor to perform with improved immunity to the negative impacts of rigid sensor packaging attachment. A planar, micro-etched interface structure is integrated into the MEMS wafer stack, which serves as the mechanical connection between the MEMS sensor and the external packaging.