US Patent 10281220 Heat sink with vapor chamber

A heat sink is disclosed in which a set of fins dissipates heat, where the heat is conducted from a heat source to two sides of the set of fins by a vapor chamber assembly. In an embodiment, a thin vapor chamber assembly is configured to conduct heat to both the bottom and the top of a set of fins. In an embodiment, a thin vapor chamber assembly is configured to conduct heat to a lower set of fins and also to an upper set of fins.