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US Patent 10290586 Package substrate with embedded noise shielding walls

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US Patent 12113033 Chip package structure
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Patent abstract

A package substrate with embedded noise shielding walls is disclosed. One of the embodiment comprises a signal line S sandwiched by a left shielding wall W1 and a right shielding wall W2. The signal line S, left shielding wall W1, and the right shielding wall W2 are embedded in a dielectric layer.

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Dyi-Chung Hu0
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US Patent 11658717 Multi-beam antenna system with a baseband digital signal processor
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https://pdfpiw.uspto.gov/.piw?Docid=102905860
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US Patent 10944180 Phased array antenna
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US Patent 11482791 Phased array antenna
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US Patent 11482791 Phased array antenna
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US Patent 11469805 Multi-beam antenna system with a baseband digital signal processor
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US Patent 10944180 Phased array antenna
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Is a
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Patent
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
102905860
Date of Patent
May 14, 2019
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Patent Application Number
154876470
Date Filed
April 14, 2017
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=102905860
Patent Citations Received
‌
US Patent 10944180 Phased array antenna
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Patent Primary Examiner
‌
Sheikh Maruf
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https://pdfpiw.uspto.gov/.piw?Docid=10290586
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US Patent 10944180 Phased array antenna
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 US Patent 10290586 Package substrate with embedded noise shielding walls

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10290586
Date of patent
May 14, 2019
Patent application number
15487647
Date Filed
April 14, 2017
Patent primary examiner
‌
Sheikh Maruf

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