US Patent 10290594 Fragmenting computer chips
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Patent abstract
A method comprising bonding a first substrate to a second substrate. The first substrate includes a layer of one or more pairs of reactive material. The method comprising triggering a reaction between the one or more pairs of reactive material and fragmenting the second substrate.
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Patent Inventor Names
Cyril Cabral, Jr.0
Kenneth P. Rodbell0
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Official Website
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Patent Jurisdiction
Patent Number
102905940
Date of Patent
May 14, 2019
0Patent Application Number
152220560
Date Filed
July 28, 2016
0Official Website
Patent Primary Examiner
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US Patent 10290594 Fragmenting computer chips
Infobox
Is a
Patent jurisdiction
Patent number
10290594
Date of patent
May 14, 2019
Patent application number
15222056
Date Filed
July 28, 2016
Patent primary examiner
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