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US Patent 10297576 Reduced form factor radio frequency system-in-package

Patent 10297576 was granted and assigned to Skyworks Solutions, Inc. on May, 2019 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 11984857 Impedance transformation circuit for amplifier
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US Patent 11870402 Impedance transformation circuit for amplifier
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Patent abstract

A packaged module for a radio frequency wireless device has a substrate supporting a first wireless device component and a second wireless device component where the first wireless device component is between the second wireless device component and a first surface of the substrate. At least a first overhanging portion of the second wireless device component extends beyond at least a portion of the periphery of the first wireless device component.

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Patent Inventor Names
Darren Roger Frenette0
George Khoury0
Lori Ann DeOrio0
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US Patent 11682649 Radio frequency modules
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=102975760
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Patent Citations Received
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US Patent 11043466 Radio frequency modules
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Infobox
Is a
Patent
Patent
0
Patent Applicant
0
Current Assignee
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
102975760
Date of Patent
May 21, 2019
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Patent Application Number
154896070
Date Filed
April 17, 2017
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=102975760
Patent Citations Received
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US Patent 10548223 Surface mount device stacking for reduced form factor
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US Patent 11043466 Radio frequency modules
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Patent Primary Examiner
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Cuong Q Nguyen
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Edits on 26 Sep, 2022
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Patent Citations Received
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US Patent 11043466 Radio frequency modules
0
"update citations for inverse infoboxes"
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edited on 26 Sep, 2022
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10297576
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Patent citations received
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US Patent 11043466 Radio frequency modules
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Patent citations received
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US Patent 10548223 Surface mount device stacking for reduced form factor
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 US Patent 10297576 Reduced form factor radio frequency system-in-package

Infobox
Is a
Patent
Patent
Patent applicant
Current assignee
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10297576
Date of patent
May 21, 2019
Patent application number
15489607
Date Filed
April 17, 2017
Patent primary examiner
‌
Cuong Q Nguyen

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