Patent attributes
A multilayer package and wireless communication device for high frequency communications, for example large-scale millimeter (mmWave) phased arrays having wide scanning range, wide bandwidth, and high efficiency. The multilayer package comprises a plurality of patch antennas disposed on a first substrate, a plurality of slotted patch antennas disposed on a third substrate, the first substrate and the third substrate being disposed on opposing sides of a second substrate, a plurality of antenna feeds disposed on a fourth substrate, the fourth substrate being disposed adjacent to the third substrate, a plurality of dipoles disposed on the first substrate, the second substrate, the third substrate, and the fourth substrate, and an impedance transformer, disposed within one or more additional substrates. The wireless communication device can include the multilayer package and an integrated circuit, wherein each of the plurality of antenna feeds is coupled to the integrated circuit by the impedance transformer.
