Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
May 21, 2019
Patent Application Number
15131355
Date Filed
April 18, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
Bonding clip used to electrically bond metal rails forming frameworks are provided. The bonding clip includes an electrically conductive back pad having a plurality of arms extending from the back pad. Each arm has one or more penetrating projections extending into a receiving zone between the arms. The arms have a lead-in at a free end. The lead-in has one or more penetrating projections extending away from the receiving zone.
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