Patent attributes
A multi-directional cooling structure for an interface card includes: a first cooling plate, configured on the interface card; a second cooling plate, configured at one side of the first cooling plate; at least one heat conduction element, configured on the first cooling plate and second cooling plate, and including a first heat conduction portion positioned on the first cooling plate and a second heat conduction portion in connection with the first heat conduction portion and positioned on the second cooling plate; and at least one cooling fin set, configured on one side of the heat conduction element away from the first and second cooling plates, and in direct contact with the heat conduction element. Therefore, the heat can be conducted not only to one side through the heat conduction element but to the cooling fin sets above, advantageously achieving multi-directional heat dissipation.
