Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 4, 2019
Patent Application Number
15891745
Date Filed
February 8, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method for manufacturing a metal bump device includes providing a substrate structure including a substrate and a metal layer having a recess on the substrate, forming a metal bump on the recess of the metal layer using a ball placement process, and forming a solder paste on the metal bump using a printing process. The manufacturing time is shorter, the manufacturing efficiency is higher, and the manufacturing cost is lower than conventional manufacturing methods.
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