US Patent 10312220 Semiconductor package and fabricating method thereof
Patent 10312220 was granted and assigned to Amkor Technology on June, 2019 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 18, 2017
Date of Patent
June 4, 2019
Patent Applicant
Patent Application Number
15707646
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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