Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 4, 2019
Patent Application Number
15592704
Date Filed
May 11, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A composite semiconductor laser is made by securing a III-V wafer to a transfer wafer. A substrate of the III-V wafer is removed, and the III-V wafer is etched into a plurality of chips while the III-V wafer is secured to the transfer wafer. The transfer wafer is singulated. A portion of the transfer wafer is used as a handle for bonding the chip in a recess of a silicon device. The chip is used as a gain medium for the semiconductor laser.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
