US Patent 10319608 Package structure and method therof

A package structure can include: (i) a substrate having opposite first and second surfaces; (ii) a die having opposite active and back surfaces, where the die is arranged above the first surface of the substrate, the back surface of the die is adjacent to the first surface of the substrate; (iii) pads arranged on the active surface of the die; (iv) a first encapsulator configured to encapsulate the die; (v) an interconnection structure configured to electrically connect to the pads through the first encapsulator; (vi) a second encapsulator configured to encapsulate the interconnection structure; and (vii) a redistribution structure configured to electrically connect to the interconnection structure and to provide external electrical connectivity.