US Patent 10319693 Micro-pillar assisted semiconductor bonding
Patent 10319693 was granted and assigned to Skorpios Technologies on June, 2019 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 16, 2015
Date of Patent
June 11, 2019
Patent Applicant
Patent Application Number
14741181
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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