Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 11, 2019
Patent Application Number
14591784
Date Filed
January 7, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
An embodiment bonded integrated circuit (IC) structure includes a first IC structure and a second IC structure bonded to the first IC structure. The first IC structure includes a first bonding layer and a connector. The second IC structure includes a second bonding layer bonded to and contacting the first bonding layer and a contact pad in the second bonding layer. The connector extends past an interface between the first bonding layer and the second bonding layer, and the contact pad contacts a lateral surface and a sidewall of the connector.
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