Patent attributes
A mobile computing device receptacle is provided. The mobile computing device receptacle has a rear enclosure with a receiving area for receiving a mobile computing device. The mobile computing device receptacle also has a first acoustic amplification component operably connected to a first side of the rear enclosure. In addition, the mobile computing device receptacle has a second acoustic amplification component operably connected to a second side of the rear enclosure. Further, the mobile computing device receptacle has a front enclosure having a first side speaker hole arrangement and a second speaker hole arrangement. The first side speaker hole arrangement is configured to be positioned over the first acoustic amplification component. In addition, the second side speaker hole arrangement is configured to be positioned over the second acoustic amplification component. A coupling mechanism couples a mobile computing device between the front enclosure and the rear enclosure.
