US Patent 10321582 Method of manufacturing wiring board and wiring board

A method of manufacturing a wiring board includes a stacking process in which N (N is an integer equal to or greater than 2) wiring layers, end portions of which include linear conductor patterns, are stacked, with the end portions superimposed, via substrates (insulating layers) provided among the wiring layers and a laminated plate is manufactured and a removing process in which the insulating layers around the end portions of the conductor patterns of the laminated plate are removed to machine the end portions into N flying leads projecting from an end face.