A cleaning pad for electronic devices includes a first layer and a second layer. The first layer has a top surface and a bottom surface. The second layer has a top surface and a bottom surface removably attached to the top surface of the first layer. The bottom surface of the second layer includes an interior portion fabricated from a cleaning material for cleaning a display of an electronic device, and an exterior portion surrounding the interior portion and fabricated from an adhesive material. The interior portion of the bottom surface of the second layer is sealed between the exterior portion of the bottom surface of the second layer and the top surface of the first layer.