US Patent 10328590 Device for treating substrates

A device for treating substrates has a separation system, with which processed substrates can be separated into one or more waste parts and at least one blank. The device for treating substrates offers improved flexibility. The separation system comprises a transport cylinder and a stripping cylinder associated therewith. The transport cylinder is able to secure replaceable packing, along with first and second openings which, when the packing is secured, are covered at least partially by perforations that may be formed in the packing. A first air supply supplies air to the first openings and a second air supply supplies air to the second openings independently of the supply of the air to the first openings. The first and the second air supply are switchable between a suction air supply and a blower air supply.