Patent 10331177 was granted and assigned to Intel on June, 2019 by the United States Patent and Trademark Office.
Particular embodiments described herein provide for device that includes a first housing that includes a first module, a second housing that includes a second module, and a hinge that rotatable couples the first housing to the second housing. The hinge can include a first axle, a second axle, and a plurality of hinge links. At least one of the hinge links includes an interconnect to provide a communication path between the first module and the second module.