Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tae Sung Jeong0
Hong Won Kim0
Date of Patent
July 2, 2019
0Patent Application Number
153526680
Date Filed
November 16, 2016
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A fan-out semiconductor package includes a redistribution layer, an interconnection member, a semiconductor chip, and a protective layer. The interconnection member has a through hole disposed on the redistribution layer. The semiconductor chip is disposed on the redistribution layer exposed within the through hole. The protective layer is formed between the redistribution layer and the interconnection member, and coupled to the interconnection member to protect the interconnection member.
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