US Patent 10340219 Semiconductor device having a metal via
Is a
Date Filed
January 11, 2018
Date of Patent
July 2, 2019
Patent Application Number
15868379
Patent Inventor Names
Hwi Chan Jun
0
Heon Jong Shin
0
Seul Ki Hong
0
Min Chan Gwak
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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