US Patent 10340234 Substrate having embedded electronic component
Patent 10340234 was granted and assigned to Samsung on July, 2019 by the United States Patent and Trademark Office.
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Patent abstract
Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
103402340
Date of Patent
July 2, 2019
0Patent Application Number
157890210
Date Filed
October 20, 2017
0Official Website
Patent Citations Received
Patent Primary Examiner
Edits on 25 Sep, 2022
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Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
103402340
Date of Patent
July 2, 2019
0Patent Application Number
157890210
Date Filed
October 20, 2017
0Official Website
Patent Citations Received
Patent Primary Examiner
Golden AI
Infobox
Patent Citations Received
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US Patent 10340234 Substrate having embedded electronic component
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10340234
Date of patent
July 2, 2019
Patent application number
15789021
Date Filed
October 20, 2017
Patent primary examiner
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