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US Patent 10340244 Semiconductor device and manufacturing method thereof

Patent 10340244 was granted and assigned to Amkor Technology on July, 2019 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Amkor Technology
Amkor Technology
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Date Filed
December 19, 2017
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Date of Patent
July 2, 2019
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Patent Applicant
Amkor Technology
Amkor Technology
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Patent Application Number
15847329
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Patent Citations Received
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US Patent 11239174 Semiconductor package structure and method for manufacturing the same
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US Patent 11990427 Chiplet first architecture for die tiling applications
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US Patent 11973041 Chiplet first architecture for die tiling applications
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US Patent 11362020 Flipchip package with an IC having a covered cavity comprising metal posts
Patent Inventor Names
Ah Ra Jo
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Dong Hyun Kim
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Jae Hun Bae
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Min Hwa Chang
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Min Yoo
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Seok Geun Ahn
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Won Chul Do
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Young Rae Kim
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10340244
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Patent Primary Examiner
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Dung A. Le
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