Patent attributes
Device structures for a field-effect transistor and methods for forming a device structure for a field-effect transistor. A first dielectric layer is formed, and a second dielectric layer are formed on the first dielectric layer. An opening is formed that extends vertically through the first and second dielectric layers. After the first opening is formed, the second dielectric layer is laterally recessed relative to the first dielectric layer with a selective etching process, which widens a portion of the opening extending vertically through the second dielectric layer relative to a portion of the opening extending vertically through the first dielectric layer. After the second dielectric layer is laterally recessed, a gate electrode is formed that includes a narrow section in the portion of the opening extending vertically through the first dielectric layer and a wide section in the portion of the opening extending vertically through the second dielectric layer.