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US Patent 10347598 Composite antenna substrate and semiconductor package module

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
March 30, 2018
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Date of Patent
July 9, 2019
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Patent Application Number
15941334
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Patent Citations Received
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US Patent 11791538 Antenna in package arrangement
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US Patent 10658765 Edge-firing antenna walls built into substrate
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US Patent 10790595 Antenna module and manufacturing method thereof
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US Patent 10903169 Conductive structure and wiring structure including the same
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US Patent 10998302 Packaged device with a chiplet comprising memory resources
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US Patent 11694986 Vias in composite IC chip structures
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US Patent 11749649 Composite IC chips including a chiplet embedded within metallization layers of a host IC chip
Patent Inventor Names
Yong Ho Baek
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Jung Hyun Cho
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Won Wook So
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Young Sik Hur
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Doo Il Kim
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10347598
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Patent Primary Examiner
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Jasmine J Clark
0

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