Is a
Patent attributes
Patent Applicant
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jichul Kim0
YoungSang Cho0
Yeo-Hoon Yoon0
Hansung Ryu0
Jae Choon Kim0
KyongSoon Cho0
Date of Patent
July 9, 2019
0Patent Application Number
154069250
Date Filed
January 16, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package is provided which includes a redistribution substrate, an interconnect substrate on the redistribution substrate, a metal layer on the semiconductor chip, a semiconductor chip on the redistribution substrate and in the hole of the interconnect substrate, and a mold layer in a gap between the semiconductor chip and the interconnect substrate. The interconnect substrate includes a hole penetrating thereinside. The interconnect substrate includes base layers and a conductive member extending through the base layers. A top surface of the interconnect substrate is positioned either above or below the level of the top surface of the metal layer.
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