US Patent 10349560 Cooling module
Patent 10349560 was granted and assigned to Hewlett Packard Enterprise on July, 2019 by the United States Patent and Trademark Office.
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Patent abstract
Example implementations relate to cooling modules. In some examples, a cooling module, can include an enclosure to replace a fan module, a first liquid cooling connector to receive and return cooling resources to a heat exchanger, and a second liquid cooling connector to provide the cooling resources to a manifold.
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Patent Inventor Names
James Lee Armes0
John Norton0
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Patent Number
103495600
Date of Patent
July 9, 2019
0Patent Application Number
157884860
Date Filed
October 19, 2017
0Official Website
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US Patent 10349560 Cooling module
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10349560
Date of patent
July 9, 2019
Patent application number
15788486
Date Filed
October 19, 2017
Patent primary examiner
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