Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 16, 2019
Patent Application Number
15823675
Date Filed
November 28, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A quantum bit (qubit) flip chip assembly may be formed when a qubit it formed on a first chip and an optically transmissive path is formed on a second chip. The two chips may be bonded using solder bumps. The optically transmissive path may provide optical access to the qubit on the first chip.
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