Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Patrick J. Kocurek0
Sankerlingam Rajendran0
Date of Patent
July 16, 2019
0Patent Application Number
153313070
Date Filed
October 21, 2016
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of lamination of dielectric circuit materials is provided. The method includes preparing first and second circuit layers of dielectric materials, stacking the first and second circuit layers with circuit trace elements interposed between the first and second circuit layers and ultrasonically welding the second circuit layer onto the first circuit layer around the circuit trace elements.
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