Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chen-Ming Huang0
Shih-Chi Lin0
Soon-Kang Huang0
You-Hua Chou0
Chih-Jen Wu0
Chih-Tsung Lee0
Chih-Yuan Yang0
Chin-Hsiang Chang0
...
Date of Patent
July 23, 2019
0Patent Application Number
156524360
Date Filed
July 18, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A polishing system includes a wafer support that holds a wafer, the wafer having a first diameter. The polishing system further includes a first polishing pad that polishes a first region of the wafer, the first polishing pad having a second diameter greater than the first diameter. The polishing system further includes an auxiliary polishing system comprising at least one second polishing pad that polishes a second region of the wafer, wherein the second polishing pad has a third diameter less than the first diameter, and the wafer support is configured to support the wafer during use of the first polishing pad and the auxiliary polishing system.
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