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US Patent 10365436 Copackaging of ASIC and silicon photonics

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Date Filed
January 4, 2018
Date of Patent
July 30, 2019
Patent Application Number
15862463
Patent Citations Received
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US Patent 12066653 Communication systems having optical power supplies
0
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US Patent 11493713 Photonic quantum computer assembly having dies with specific contact configuration and matched CTE
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US Patent 12029004 Data processing systems including optical communication modules
0
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US Patent 11493714 Quantum computing die assembly with thru-silicon vias and connected logic circuit
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US Patent 10575437 Temperature control method, system, and apparatus
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US Patent 10645845 Forced flow cooling temperature control method, system, and apparatus
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US Patent 11550108 Quantum computing die assembly with thru-silicon vias
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US Patent 10782258 Superconductor critical temperature measurement
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US Patent 11569180 Corner structures for an optical fiber groove and manufacturing methods thereof
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US Patent 11256049 Optical-to-electric-to-optical routing engine
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10365436

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