A light emitting diode (LED) module for a light fixture includes a substrate with an upper surface and a lower surface. Various pressure multiplying pads are integrally connected to the lower surface, and each pressure multiplying pad extends away from the lower surface. LEDs are attached to the upper surface, along with a set of conductive lines so that each conductive line electrically connects a corresponding LED to a power inputs. Each of the pressure multiplying pads may be positioned opposite a corresponding LED. A flexible lens cover may cover the upper surface and the LEDs, while leaving the lower surface and pressure multiplying pads exposed so that the pads can contact a heat sink of the light fixture.