US Patent 10379688 Transcapacitive matrix sensor with via routing

Disclosed herein include a processing system, an input device, and methods for transcapacitive sensing. In one example, a processing system is configured to reduce the capacitive coupling between sensor electrodes arranged in a column of sensor electrodes and routing traces running below the sensor electrodes by isolating a receiver electrode selected from the sensor electrodes in the column from the other sensor electrodes in the column by applying a signal that is not modulated relative to the receiver electrode on sensor electrodes that are immediately adjacent the receiver electrode and not being utilized as a transmitter electrode.