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US Patent 10381233 Method and apparatus for substrate processing

Patent 10381233 was granted and assigned to Tokyo Electron on August, 2019 by the United States Patent and Trademark Office.

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Patent abstract

A substrate processing method according to exemplary embodiments includes bringing removal solution obtained by mixing a nitric acid, a strong acid stronger than the nitric acid, and water into contact with a substrate in which a boron monofilm is formed on a film including a silicon-based film so as to remove the boron monofilm from the substrate.

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