US Patent 10383253 Sealable multi-surface electronics thermal conduction package
Patent 10383253 was granted and assigned to NIO (car company) on August, 2019 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
March 27, 2018
0
Date of Patent
August 13, 2019
0
Patent Applicant
Patent Application Number
15937521
0
Patent Citations Received
Patent Inventor Names
Nermin Mujcinovic
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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