Patent 10386225 was granted and assigned to Mitsubishi Electric Corporation on August, 2019 by the United States Patent and Trademark Office.
A semiconductor light reception module is provided with a stem, a cap covering the stem, a holder superimposed on the cap, and a receptacle inserted into the holder. The holder has a main body section covering the lens in the cap. An opening passing from the opposite side of the cap through the main body section and reaching the lens is provided in the main body section of the holder. A fixing screw is inserted into a screw hole provided in the holder and a screw tip of a screw main body section of the fixing screw abuts against a side surface of the receptacle.