Patent attributes
A purge configurable wafer shipper. The container includes an enclosure portion with an open side or bottom, a door to sealing close the open side or bottom. One of the door and the container portion includes an opening formed in the enclosure portion to provide a fluid passageway from an interior of the wafer shipper to an exterior region. The opening may include a module receiving structure that defines the fluid passageway. A sealing member is included for insertion into the module receiving structure. The sealing member has a body portion including a support flange positioned proximate a lower portion of the body portion, a circumferential groove in the exterior surface of the body portion, and an O-ring positioned at least partially within the circumferential groove.
